Course: AIT123 First Term: 2019 Summer
Final Term: Current
Final Term: 2020 Fall
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Lec + Lab 3.0 Credit(s) 4.0 Period(s) 4.0 Load
Credit(s) Period(s)
Load
Subject Type: OccupationalLoad Formula: T - Lab Load |
MCCCD Official Course Competencies | |||
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1. Explain IPC J-STD-001 Professional Policies, Procedures and General Requirements. (I)
2. Demonstrate assembly of soldered wires and terminals. (II) 3. Demonstrate assembly of soldered plated through hole (PTH) components. (III) 4. Demonstrate assembly of soldered surface mount technology (SMT) components. (IV) 5. Evaluate and inspect assemblies for acceptance/reject decisions. (V) | |||
MCCCD Official Course Competencies must be coordinated with the content outline so that each major point in the outline serves one or more competencies. MCCCD faculty retains authority in determining the pedagogical approach, methodology, content sequencing, and assessment metrics for student work. Please see individual course syllabi for additional information, including specific course requirements. | |||
MCCCD Official Course Outline | |||
I. Introduction to IPC professional policies, procedures and general requirements
A. Materials, components and equipment B. General soldering and assembly II. Wire and terminals A. Stripping and tinning B. Turret terminals C. Bifurcated terminals D. Hook Terminal E. Pierced terminals F. Cup Terminals III. Plated through hole components A. Axial lead components B. Radial Lead components C. Spacers D. Dual in-line package (DIP) components IV. Surface mount technology A. Chip components B. J-lead components C. Gull wing lead components D. Cylindrical end cap components E. DPAK components V. Evaluation and inspection of assemblies | |||
MCCCD Governing Board Approval Date: June 25, 2019 |