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Center for Curriculum and Transfer Articulation
Electrical Wiring J-STD Soldering Certification
Course: AIT123

First Term: 2019 Summer
Lec + Lab   3.0 Credit(s)   4.0 Period(s)   4.0 Load  
Course Type: Occupational
Load Formula: T - Lab Load

Description: This course will prepare the successful student to receive the "Certified IPC Specialist" (CIS) certification from The Institute for Interconnecting and Packaging Electronic Circuits (IPC) in "Requirements for Soldered Electrical and Electronic Assemblies" (IPC J-STD-001). Topics covered and skills to be demonstrated are: soldered wires and terminals, through hole connections, surface mount components, and inspection. Certification is verified by a certified IPC trainer (CIT).

MCCCD Official Course Competencies
1. Explain IPC J-STD-001 Professional Policies, Procedures and General Requirements. (I)
2. Demonstrate assembly of soldered wires and terminals. (II)
3. Demonstrate assembly of soldered plated through hole (PTH) components. (III)
4. Demonstrate assembly of soldered surface mount technology (SMT) components. (IV)
5. Evaluate and inspect assemblies for acceptance/reject decisions. (V)
MCCCD Official Course Outline
I. Introduction to IPC professional policies, procedures and general requirements
   A. Materials, components and equipment
   B. General soldering and assembly
II. Wire and terminals
   A. Stripping and tinning
   B. Turret terminals
   C. Bifurcated terminals
   D. Hook Terminal
   E. Pierced terminals
   F. Cup Terminals
III. Plated through hole components
   A. Axial lead components
   B. Radial Lead components
   C. Spacers
   D. Dual in-line package (DIP) components
IV. Surface mount technology
   A. Chip components
   B. J-lead components
   C. Gull wing lead components
   D. Cylindrical end cap components
   E. DPAK components
V. Evaluation and inspection of assemblies
MCCCD Governing Board Approval Date: June 25, 2019

All information published is subject to change without notice. Every effort has been made to ensure the accuracy of information presented, but based on the dynamic nature of the curricular process, course and program information is subject to change in order to reflect the most current information available.